How is a rigid-flex circuit board produced? 

The production of rigid-flexible circuit boards varies depending on the construction. The production of a 1F-1Ri construction serves as an example. 

The manufacturing process is largely comparable with that for the production of a 4-layer multilayer. Differences are seen in the materials and the additional milling processes: 

1.) Core graver routing > no-flow prepreg milling > pressing:  

2.) Drilling > plating > conductor pattern > 2x flexible solder-mask:  

3.) Z-axis milling:  

4.) Contour milling > electrical testing