Immersion Silver 

Tech Info:  

• Immersion Silver  
• Typ. Ag-coat 0.2 – 0.4 µm  
• Process temperature ~ 50 °C  
• Shelf life 12 months  

Advantages:

• Smooth coating  
• Excellent wetting behaviour  
• No additional costs compared with SnPb-HASL  
• Good solderability /hole filling  
• Application of solder agents with or without lead possible  
• Easy multiple soldering  
• No intermetalic phase between copper and silver  
• No impairment of solderability after the drying process  

Disadvantages: 

• Restricted storage between multiple solder processes  
• Surface might tarnish  

Application fields:

• Standard PCBs  
• HDI / Microvia boards  
• FLATcomp circuit boards  
• Rigid-flexible circuit boards