Thermal management for circuit boards
Würth Elektronik has developed a clever heat management concept that uses constructive procedures to dissipate heat directly on the circuit board level. This is an economic way of protecting high-performance components against excess temperatures and it ensures flawless functioning and high durability.
Heatsink technology highlights - an overview:
- Heatsink applications offer optimized heat management
- Thin circuit board for good heat conduction and high cycle stability
- Combination of vertical and horizontal cooling
- Vertical cooling through thermovias or microvia/buried via combination
- Horizontal cooling through heat spreading in copper layers and/or heatsink
- Low thermal resistance
- Various thicknesses possible
- Customized forms possible
- Photosensitive solder stop, various final surfaces possible
- Suitable for wire bonds
