Immersion Silver

Technical information:

  • Immersion Silver  
  • Typ. Ag-coat 0.2 – 0.4 µm  
  • Process temperature ~ 50 °C  
  • Shelf life 12 months  

Advantages:

  • Smooth coating    
  • Excellent wetting behaviour    
  • No additional costs compared with SnPb-HASL    
  • Good solderability /hole filling    
  • Application of solder agents with or without lead possible    
  • Easy multiple soldering    
  • No intermetalic phase between copper and silver    
  • No impairment of solderability after the drying process    

Disadvantages:

  • Restricted storage between multiple solder processes    
  • Surface might tarnish    

Application fields:

  • Standard PCBs  
  • HDI / Microvia boards  
  • Flex-rigid boards